The opportunity
SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.
What you'll do
Own package-level (HTOL, LTOL, etc.) and wafer-level (TDDB, ECM, etc.): reliability qualification and testing of new silicon designs and manufacturing technologies for high-volume production
Plan, develop, execute, and analyze reliability test campaigns aligned with JEDEC and related standards
Develop and procure custom test hardware, fixturing, burn-in boards, and: environmental chambers/systems required for package-level and wafer-level reliability testing
Design and develop PCBs and electrical interfaces for reliability test: fixtures, sockets, and monitoring systems
Develop software, automation scripts, and data acquisition tools (e.g.,: Python) to control test equipment, log telemetry, perform real-time monitoring, and analyze large reliability datasets
Perform hands-on debugging and electrical characterization to drive root: cause and corrective action of silicon, package, and interconnect failures observed in reliability testing, production, or the field
What they're looking for
- Utilize advanced diagnostic and test tools (oscilloscopes, power supplies,: vector network analyzers, custom firmware/scripts, thermal chambers, etc.) to characterize devices under stress and isolate failure mechanisms
- Run reliability failure investigations, coordinating efforts across silicon: design, packaging, manufacturing, and reliability teams, and communicating findings to leadership
- Analyze reliability data (Weibull, acceleration models, etc.) to predict: field performance, document failure modes, and drive design/process improvements for higher yield and reliability
- Partner with design, packaging, software, test, and manufacturing engineering: teams to deliver reliable silicon hardware by informing product design, package selection, process changes, and test coverage