The opportunity
SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.
What you'll do
Own packaging assembly processes from concept to mass production including: equipment and material selection for wafer-level and chip-level systems
Develop new technologies and establish baselines for assembly and packaging: including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach
Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
Own packaging prototypes, product development and release to production
Select equipment and material to meet quality, reliability, cost, yield, and production targets
Interface with equipment and material suppliers including continuous: improvement plans, cost reduction, and productivity improvements
What they're looking for
- Cross-functional interface with IC design, materials, thermal, systems, and production teams
- Implement advanced packaging solutions into SpaceX next generation products
- Bachelor’s degree in electrical engineering, mechanical engineering, chemical: engineering, materials science, physics, or other applied engineering discipline
- + years of professional experience in semiconductor assembly and packaging