The opportunity
OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models.
What you'll do
Lead reliability test plan and assessments for advanced HPC packages,: including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development.
Drive reliability-focused package design optimization based on: thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability.
Develop, validate, and apply package reliability models and: lifetime-prediction methodologies for assembly, qualification, and product operating conditions.
Evaluate and recommend package architectures, structural designs, materials,: and assembly processes to maximize reliability performance and manufacturing robustness.
Predict electromigration lifetime of package interconnects under: product-specific current, temperature, workload, duty-cycle, and PCB boundary conditions.
Enjoy solving complex reliability challenges associated with cutting-edge HPC: packages, including very large package form factors, high power, and high-speed chip integration.
What they're looking for
- Experience developing electromigration or interconnect lifetime models for: solder joints, vias, redistribution layers, interposers, or package power-delivery structures.
- Knowledge of package qualification methods, acceleration models, thermal: cycling, power cycling, current-stress testing, and reliability lifetime extrapolation.
- Familiarity with package failure-analysis techniques such as acoustic: microscopy, X-ray imaging, cross-sectioning, scanning electron microscopy, and material characterization.
- Experience supporting package-integrated voltage regulation, high-current: power delivery, or high-transient-current AI and HPC products.
- MS or PhD in Mechanical Engineering, Electrical Engineering, Materials: Science, Physics, or a related technical field.
- Strong communication, cross-functional collaboration, and technical leadership skills.
