The opportunity
About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems…
What they're looking for
- Are excited to develop new reliability test methodologies, predictive models,: and engineering solutions rather than relying solely on conventional industry practices.
- Are motivated by pushing the limits of heterogeneous verfical integration: (chip/package/system), high-current power delivery, advanced cooling, and large-scale package architectures.
- Want to influence product architecture and design decisions through: simulation-driven insights across chip, package, cooling, and system levels.
- Enjoy learning broadly across semiconductor technologies, including chip: architecture, power delivery, package integration, materials, cooling, and system-level interactions.