The opportunity
SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.
What you'll do
Own end-to-end root cause failure analysis investigations on microelectronics: failing in manufacturing, test, and field, from initial failure characterization through final corrective action verification
Conduct advanced electrical fault isolation and characterization using curve: trace, TDR, RF characterization, Lock-in Thermography, OBIRCH, EBIRCH, EBAC, nanoprobing, and related techniques to precisely localize defects in complex devices
Perform advanced physical failure analysis using SEM, FIB, EDS, SAM,: cross-sectioning, and related techniques to identify failure mechanisms in silicon, packaging, and interconnects
Apply physics-of-failure principles and deep knowledge of semiconductor: failure modes (electromigration, thermal fatigue, delamination, EOS/ESD, solder joint fatigue, etc.) to determine root causes
Drive corrective actions by working directly with silicon design, packaging,: and manufacturing teams to implement and validate design or process changes based on FA findings
Author detailed technical reports documenting failure modes, root cause: conclusions, supporting data, and corrective action effectiveness
What they're looking for
- Develop and improve failure analysis techniques and workflows to support new: packaging technologies and advanced materials
- Bachelor’s degree in materials science, electrical engineering, physics,: chemical engineering, or other STEM discipline
- + years of hands-on experience in microelectronics failure analysis or: materials characterization (internship experience is applicable)
- Master’s or PhD in materials science, electrical engineering, physics,: chemical engineering, or other STEM discipline with a focus on microelectronics or failure analysis
