Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis)Posted today

The opportunity

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

What you'll do

  • Develop and qualify GGI and thermosonic flip-chip / die-attach processes,: including bond force, temperature, ultrasonic energy, bond time, alignment, parallelism, and tool selection; establish process windows with DOE to control bond integrity, contact resistance, and mechanical strength

  • Develop gold stud bump, gold bump, and gold-to-gold interconnect processes: and evaluate bond quality and process capability

  • Develop and optimize vacuum mold lamination and related encapsulation: (material selection, vacuum, temperature, pressure, time, and cure); troubleshoot voiding, delamination, die shift, warpage, incomplete fill, and bleed

  • Support related assembly steps as needed: wafer/die handling, placement, plasma/surface cleaning, underfill, reflow, singulation, laser marking, and inspection

  • Select and characterize assembly materials (adhesives, mold compounds,: substrates, interconnect materials) for impact on bond strength, adhesion, thermal performance, warpage, and reliability

  • Specify, evaluate, install, and qualify assembly equipment (flip-chip: bonders, thermosonic bonders, vacuum laminators, plasma, and inspection tools) with suppliers

What they're looking for

  • Run DOEs, capability studies, and SPC on critical parameters; write process: specs, work instructions, control plans, FMEAs, and qualification reports
  • Drive NPI from prototype through qualification and production release;: perform root-cause analysis and support failure analysis (X-ray, SAM, optical, cross-section, SEM)
  • Correlate process settings to electrical, mechanical, and reliability: results; apply DFM and own schedules, risks, and production readiness for assigned technologies
  • Bachelor's degree in chemical engineering, materials science, mechanical: engineering, or other engineering discipline