The opportunity
SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.
What you'll do
Develop and qualify wafer back-grinding, thinning, stress-relief, and: backside finishing processes; set thickness, TTV, bow, warp, and roughness targets while minimizing chipping, cracking, subsurface damage, and edge defects
Develop and optimize mechanical wafer dicing (including thin wafers and: difficult materials such as SiC); select blades, tapes, and parameters (speed, feed, depth, coolant, dressing, single- or multi-pass) and control chipping, sidewall quality, delamination, and street/exclusion requirements
Establish post-dice die cleaning, drying, handling, tape mount/release (UV: and non-UV), pick, sort, and presentation methods that protect die integrity, orientation, and traceability for flip-chip, wire-bond, and other assembly flows
Develop and qualify laser marking processes for wafers and bare die: (including green/UV sources); optimize mark contrast and resolution while avoiding damage to electrical performance, metallization, passivation, or mechanical integrity, and implement vision/OCR verification
Develop final package singulation (saw, laser, or mechanical) for organic,: mold, ceramic, and metal structures; minimize cracking, chipping, delamination, burrs, and edge defects and confirm impact on warpage, electrical performance, and reliability
Run DOEs, define process windows and controls, troubleshoot defects, qualify: equipment and consumables, incorporate supplier and production feedback, and transfer robust processes into manufacturing
What they're looking for
- Bachelor's degree in chemical engineering, materials science, mechanical: engineering, or other engineering discipline
- + years of hands-on experience in semiconductor wafer processing, thinning,: dicing, die preparation, or manufacturing (Internship or extracurricular experience is applicable)
- + years of hands-on semiconductor manufacturing experience, including wafer: back-grinding/thinning (including ≤150 µm wafers) and mechanical dicing/blade selection
- Experienced in operating and developing processes on semiconductor equipment,: plus solid understanding of wafer and die handling, process troubleshooting, and statistical process control