The opportunity
OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models.
What you'll do
Own quality for advanced interconnect components and assemblies: high-speed connectors, high-speed copper cables, cable cartridges (e.g., cable cassette style assemblies), patch panels & optics, and backplane/cable-backplane interconnect solutions.
Drive quality-by-design: participate in design reviews, DFM/DFx, tolerance stacks, material and plating selections, connector mating strategy, strain relief, and assembly methods to reduce variation and field failures.
Define and track quality and reliability metrics (DPPM, yield, escapes,: RMA/FRACAS trends, Cpk/Ppk where applicable) for interconnects across NPI and mass production.
Build and execute qualification strategies for cables/connectors/patch panels: (mechanical, environmental, electrical, and reliability), including test coverage, sample plans, clear pass/fail criteria, defining installation criteria and processes, optics termination quality management and setting fiber standards criteria.
Partner with engineering and operations to drive smooth ramp: risk assessments, pilot build learnings, change control, and readiness reviews (EVT/DVT/PVT/MP or equivalent phases).
Own supplier and CM performance management: scorecards, audits (process and quality system), and follow-up to close findings with verified effectiveness
What they're looking for
- Work with suppliers to improve manufacturing throughput, stability, and: yields for cable and connector assembly processes (e.g., wire prep, welding/crimping, overmolding/injection molding, plating, and assembly fixturing).
- Lead rapid containment and root-cause investigations for failures found: during bring-up, system integration tests, reliability testing, and fleet deployments.
- Own the end-to-end corrective action process (8D, 5-Whys, Ishikawa, DOE as: needed): define problem statements, isolate variables, validate root cause, implement fixes, and verify effectiveness.
- Partner with SI/PI and test teams to correlate electrical performance issues: (e.g., link margin, BER, eye closure, impedance discontinuities, PAM4, TDR and VNA) with manufacturing and mechanical drivers (connector wear, plating, contamination, misalignment, cable routing, assembly variation).
