The opportunity
About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems…
What they're looking for
- Work with suppliers to improve manufacturing throughput, stability, and: yields for cable and connector assembly processes (e.g., wire prep, welding/crimping, overmolding/injection molding, plating, and assembly fixturing).
- Lead rapid containment and root-cause investigations for failures found: during bring-up, system integration tests, reliability testing, and fleet deployments.
- Own the end-to-end corrective action process (8D, 5-Whys, Ishikawa, DOE as: needed): define problem statements, isolate variables, validate root cause, implement fixes, and verify effectiveness.
- Partner with SI/PI and test teams to correlate electrical performance issues: (e.g., link margin, BER, eye closure, impedance discontinuities, PAM4, TDR and VNA) with manufacturing and mechanical drivers (connector wear, plating, contamination, misalignment, cable routing, assembly variation).
