The opportunity
OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to…
What you'll do
Lead mechanical design for AI supercomputer product in the data center application
Collaborate with the cross functional team to design and optimize thermal: solutions for data center hardware, including chips, power modules, and system-level cooling architectures
Collaborate with cross-functional teams to integrate thermal management: strategies into hardware design, from concept to mass production
Design and validate mechanical systems, including chassis, enclosures,: cooling systems, and high-power connections, ensuring alignment with performance and reliability standards.
Perform 3D modeling, FEA, tolerance analysis, and prototyping, ensuring: manufacturability and adherence to strict quality requirements.
Conduct mechanical testing, including vibration, shock, and thermal cycling,: to ensure long-term reliability under extreme operating conditions.
What they're looking for
- Identify and evaluate new technologies and methodologies to improve: mechanical and thermal performance in product design, and contribute to the development of new products and technology by providing expertise in mechanical design
- Develop appropriate specifications and test procedures as necessary to ensure: desired reliability and performance of electronic equipment, collaborate, supervise, mentor, and motivate suppliers to design and develop excellent products, and mentor engineers in all aspects of concept development, analysis, design, and specification
- Lead the production and launch of new products and technologies and ensure: compliance with relevant quality standards and regulation
- Partner with suppliers and manufacturers to support the development of custom: mechanical and thermal components and ensure quality in production
