The opportunity
OpenAI’s Forward Deployed Engineering team partners with leading semiconductor companies to deploy production-grade AI systems across the entire chip design lifecycle: design, verification, and physical design. We operate at the intersection of customer delivery and core…
What you'll do
Serve as the physical design SME for semiconductor customer engagements,: helping FDE teams understand backend implementation workflows, constraints, and opportunities
Partner with FDEs during customer discovery and scoping to translate: ambiguous pain points into clear solution hypotheses, success criteria, and technical plans
Support customer-facing technical conversations as a trusted advisor, engaging credibly with technical leaders
Help shape AI-assisted solutions across physical design workflows, including: floorplanning, place and route, clocking, timing closure, congestion, power, physical verification, and signoff
Guide feasibility and integration decisions across the entire chip design: lifecycle: design, verification, and physical design
Partner with FDEs and customer SMEs to curate evaluation datasets, golden: tasks, rubrics, and acceptance criteria for physical design use cases, ensuring evals reflect real workflows and meaningful success metrics
What they're looking for
- Build or guide lightweight prototypes, benchmarks, methodology experiments,: and internal tools that validate opportunities and accelerate solution development
- Educate and mentor the broader FDE team on physical design concepts,: implementation flows, EDA tooling, and key trade-offs so the org can engage customers with greater depth and confidence
- Surface repeated customer signal to Product and Research to help shape: roadmap, model behavior, and platform capabilities for semiconductor use cases
- Progressively take on broader FDE responsibilities, including customer: discovery, solution architecture, prototype development, production deployment, and ownership of technical workstreams
